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UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
UK Research & Innovation
Awarded
goods
SME-friendly
This tender has closed
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Key details
Contracting authority
Region
South East
Delivery: South East, United Kingdom
Sector
Contract value
£250,000ex VAT
Submissions closed
13 February 2024
Published
8 December 2023
Procurement
Contract period
15 February 2024 - 30 July 2024
5 months
Procedure type
Other -
CPV classifications
- 31712000 Microelectronic machinery and apparatus and microsystems
What happened
UK Research & Innovation awarded this contract to Inseto (UK) Limited worth £250,000 on 13 Feb 2024. The contract runs until 30 Jul 2024.
Description
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.
Awarded supplier
Supplier
Inseto (UK) Limited
Award value
£250,000
Award date
13 February 2024
Contact
Address
North Star Avenue, Swindon, SN2 1FL
Contact name
STFC Procurement
Email
Phone
Identifiers
Buyer reference
BIP842513727
Notice ID
ff94b41f-0998-4aa9-88d6-98f74526d0de-723867
OCID
ocds-b5fd17-8d171fb7-eeb5-4d8f-a8d7-39f637926ff7
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External ID: cf-ocds-b5fd17-8d171fb7-eeb5-4d8f-a8d7-39f637926ff7 • Added 3 October 2026