NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements.

The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells.

The initial focus will be procuring equipment as a 3 cell solution as Cell 6, Cell 7 and Cell 8 of a production line to support die bonding, wire bonding and encapsulation and associated ancillaries required. The University is seeking a supplier to supply, deliver and commission all of the equipment to provide the following overall capability:

Cell 6: Die Attach

• Automatic die bonding
• Vacuum oven curing
• Plasma cleaning

Cell 7: Interconnection

• Multi-head wire bonding
• Ultrasonic bonding

Cell 8: Encapsulation

• Overmoulding
• Dam and fill encapsulation
• Oven curing

The buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 25674. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343

Community benefits are included in this requirement. For more information see: https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/

A summary of the expected community benefits has been provided as follows:

Please see Procurement documents for full details